Wiring structure, manufacturing method thereof, and display device

ABSTRACT

A wiring structure includes a plurality of first connection lines disposed in a first wiring layer and extending respectively from first ones of the plurality of first electrical contacts to first ones of the plurality of second electrical contacts, the first connection lines not intersecting each other; and a plurality of second connection lines disposed in a second wiring layer and extending respectively from second ones of the plurality of first electrical contacts to second ones of the plurality of second electrical contacts, the second connection lines not intersecting each other. An orthographic projection of any one of the first connection lines onto a plane parallel to the first and second wiring layers does not intersect an orthographic projection of any one of the second connection lines onto the plane.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a 35 U.S.C. 371 national stage application ofPCT International Application No. PCT/CN2019/071127, filed on Jan. 10,2019, which claims priority to Chinese Patent Application No.201810201134.8 filed on Mar. 12, 2018, the entire disclosure of which isincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to the field of display technologies, andin particular, to a wiring structure, a method of manufacturing thewiring structure, and a display device.

BACKGROUND

With the increasing popularity of the bezel-less screen concept, thenarrow bezel design of portable electronic devices such as mobile phoneshas received wide attention. Touch and Display Driver Intergation (TDDI)facilitates the implementation of a narrow bezel by integrating touchdriver circuitry and display driver circuitry into a single driver chip.However, in current TDDI products, there are often undesiredintersections in the wiring between the driver chip and the touchdisplay panel.

SUMMARY

According to some exemplary embodiments of the present disclosure, awiring structure is provided for connecting a plurality of firstelectrical contacts to respective ones of a plurality of secondelectrical contacts, the plurality of first electrical contacts beingarranged in a straight line over a first span, the plurality of secondelectrical contacts being arranged in a straight line over a secondspan, the second span being less than the first span. The wiringstructure comprises: a plurality of first connection lines in a firstwiring layer, wherein the plurality of first connection lines extendrespectively from first ones of the plurality of first electricalcontacts to first ones of the plurality of second electrical contactsand do not intersect each other; and a plurality of second connectionlines in a second wiring layer, wherein the plurality of secondconnection lines extend respectively from second ones of the pluralityof first electrical contacts to second ones of the plurality of secondelectrical contacts and do not intersect each other. An orthographicprojection of any one of the first connection lines onto a planeparallel to the first and second wiring layers does not intersect anorthographic projection of any one of the second connection lines ontothe plane.

In some embodiments, the plurality of first connection lines and theplurality of second connection lines are arranged such that the firstconnection lines and the second connection lines alternate with eachother when viewed from a direction perpendicular to the first and secondwiring layers.

In some embodiments, the first and second connection lines thatalternate with each other are divided into a plurality of first groupsconfigured to transfer a first type of signals and a plurality of secondgroups configured to transfer a second type of signals, and the firstgroups and the second groups alternate with each other.

In some embodiments, the plurality of first groups each comprise atleast one of the first connection lines and at least one of the secondconnection lines, and the plurality of second groups each comprise atleast one of the first connection lines and at least one of the secondconnection lines.

In some embodiments, the plurality of first groups each comprise atleast one of the first connection lines and at least one of the secondconnection lines, and the plurality of second groups each comprise oneof the first connection lines or one of the second connection lines.

In some embodiments, the first connection lines are different inquantity from the second connection lines.

In some embodiments, the first connection lines and the secondconnection lines are metal lines.

In some embodiments, the wiring structure further comprises aninsulating layer between the first wiring layer and the second wiringlayer.

According to some exemplary embodiments of the present disclosure, amethod of manufacturing a wiring structure is provided. The wiringstructure is for connecting a plurality of first electrical contacts torespective ones of a plurality of second electrical contacts, theplurality of first electrical contacts being arranged in a straight lineover a first span, the plurality of second electrical contacts beingarranged in a straight line over a second span, the second span beingless than the first span. The method comprises: forming in a firstwiring layer a plurality of first connection lines that extendrespectively from first ones of the plurality of first electricalcontacts to first ones of the plurality of second electrical contacts,wherein the first connection lines do not intersect each other; andforming in a second wiring layer a plurality of second connection linesthat extend respectively from second ones of the plurality of firstelectrical contacts to second ones of the plurality of second electricalcontacts, wherein the second connection lines do not intersect eachother. An orthographic projection of any one of the first connectionlines onto a plane parallel to the first and second wiring layers doesnot intersect an orthographic projection of any one of the secondconnection lines onto the plane.

According to some exemplary embodiments of the present disclosure, adisplay device is provided comprising the wiring structure as describedabove.

In some embodiments, the display device further comprises: a touchdisplay panel comprising touch signal lines and display signal lines;and a driver integrated with a touch driving circuit and a displaydriving circuit, wherein the driver comprises a bonding area and aplurality of first pins and a plurality of second pins in the bondingarea, the first pins are configured to supply display signals, thesecond pins are configured to supply touch signals, and the first pinsand the second pins are arranged in a straight line in the bonding area.The display signal lines are connected to the first pins via the wiringstructure. The touch signal lines are connected to the second pins viathe wiring structure.

In some embodiments, the display device further comprises a glasssubstrate carrying the driver.

In some embodiments, the display device further comprises a thin filmsubstrate carrying the driver.

In some embodiments, the touch display panel is a self-capacitive touchdisplay panel.

In some embodiments, the touch display panel is a mutual capacitivetouch display panel.

These and other exemplary embodiments of the present disclosure will beapparent from and elucidated with reference to the embodiment(s)described hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

Further details, features and advantages of the present disclosure aredisclosed in the following description of exemplary embodiments inconjunction with the accompanying drawings in which:

FIG. 1 is a schematic view showing a typical wiring structure in afan-out area of a TDDI product;

FIG. 2 is a schematic view generally showing a wiring structureaccording to an exemplary embodiment of the present disclosure;

FIG. 3 is a schematic view showing a display device in which a wiringstructure according to an exemplary embodiment of the present disclosuremay be applied;

FIG. 4 schematically shows the connection relationship between theconnection lines and the signal lines in FIG. 3 in an enlarged view;

FIG. 5 schematically shows a variation of the connection relationshipshown in FIG. 4 in an enlarged view;

FIG. 6 schematically shows another variation of the connectionrelationship shown in FIG. 4 in an enlarged view;

FIG. 7 is a cross-sectional view taken along line A-A in FIG. 4;

FIG. 8 is a schematic view showing various pin arrangements of a TDDIdriver used in cooperation with a wiring structure according to anexemplary embodiment of the present disclosure;

FIG. 9 is a schematic view showing a connection relationship between awiring structure according to an exemplary embodiment of the presentdisclosure and a TDDI driver; and

FIG. 10 is a flow chart showing a method of manufacturing a wiringstructure according to an exemplary embodiment of the presentdisclosure.

The figures are not necessarily drawn to scale, and the same referencesign refers to the same element throughout.

DETAILED DESCRIPTION

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present disclosure.

Spatially relative terms, such as “beneath”, “below”, “lower”, “under”,“above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. For example, if the device inthe figures is turned over, elements described as “below” or “beneath”or “under” other elements or features would then be oriented “above” theother elements or features. Thus, the exemplary terms “below” and“under” can encompass both an orientation of above and below. Terms suchas “before” or “preceding” and “after” or “followed by” may be similarlyused, for example, to indicate an order in which light passes throughthe elements. The device may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein interpreted accordingly. In addition, it will also be understoodthat when a layer is referred to as being “between” two layers, it canbe the only layer between the two layers, or one or more interveninglayers may also be present.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to”, “coupled to”, or “adjacent to” anotherelement or layer, it can be directly on, connected, coupled, or adjacentto the other element or layer, or intervening elements or layers may bepresent. In contrast, when an element is referred to as being “directlyon,” “directly connected to”, “directly coupled to”, or “immediatelyadjacent to” another element or layer, there are no intervening elementsor layers present. In no event, however, should “on” or “directly on” beconstrued as requiring a layer to completely cover an underlying layer.

Embodiments of the disclosure are described herein with reference toschematic illustrations of idealized embodiments (and intermediatestructures) of the disclosure. As such, variations from the shapes ofthe illustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of thedisclosure should not be construed as limited to the particular shapesof regions illustrated herein but are to include deviations in shapesthat result, for example, from manufacturing. Accordingly, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the actual shape of a region of a device andare not intended to limit the scope of the disclosure.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

FIG. 1 is a schematic view showing a typical wiring structure 100 in afan-out area of a TDDI product.

Referring to FIG. 1, in a fan-out area FA of a touch display panel 20,display signal connection lines 101 are connected to a driver chip 10 inthe middle of a bonding area BA of the driver chip 10, and touch signalconnection lines 102 are connected to the driver chip 10 on both sidesof the bonding area BA of the driver chip 10. The display signalconnection lines 101 and the touch signal connection lines 102 aretypically wired in different metal layers, and thus are indicated in thefigure by solid lines and dashed lines, respectively. Such a wiringapproach may result in an intersection between orthographic projectionsof the display signal connection lines 101 and those of the touch signalconnection lines 102 onto the circuit board on which they are carried,thereby generating parasitic capacitance that affects the touchperformance. In addition, this wiring approach leads to a largefootprint of the connection lines 101 and 102, which is disadvantageousfor achieving a narrow bezel design.

FIG. 2 is a schematic view generally showing a wiring structure 200according to an exemplary embodiment of the present disclosure.

Referring to FIG. 2, the wiring structure 200 includes a plurality offirst connection lines 201 and a plurality of second connection lines202, which connect a plurality of first electrical contacts 210 torespective ones of a plurality of second electrical contacts 220. Theplurality of first electrical contacts 210 are arranged in a straightline over a first span 51, and the plurality of second electricalcontacts 220 are arranged in a straight line over a second span S2, withthe second span S2 being less than the first span 51.

The first connection lines 201, indicated by solid lines, are disposedin a first wiring layer (not shown) and extend respectively from firstones of the plurality of first electrical contacts 210 to first ones ofthe plurality of second electrical contacts 220. The first connectionlines 201 do not intersect each other. The second connection lines 202,indicated by dashed lines, are disposed in a second wiring layer (notshown) and extend respectively from second ones of the plurality offirst electrical contacts 210 to second ones of the plurality of secondelectrical contacts 220. The second connection lines 202 do notintersect each other. An orthographic projection of any one of the firstconnection lines 201 onto a plane parallel to the first and secondwiring layers (i.e., the paper plane in the example of FIG. 2) does notintersect an orthographic projection of any one of the second connectionlines 202 onto the plane. Further, the number of the first connectionlines 201 and the number of the second connection lines 202 may be thesame or different. Typically, the first connection lines 201 and thesecond connection lines 202 may be made of metal such as copper,aluminum, silver or alloys thereof. This provides good electricalconductivity and process compatibility.

In FIG. 2, the first electrical contacts 210 are illustrated as beingdisposed parallel to the second electrical contacts 220, although otherembodiments are possible. Parameter a represents a pitch between thefirst electrical contacts 210, parameter b represents a pitch betweenthe directly adjacent connection lines 201 and 202 (when viewed fromabove), the magnitude of which is related to the process capability,parameter c is a horizontal distance between the first one of the firstelectrical contacts 210 and the first one of the second electricalcontacts 220, and parameter d represents the size of the footprint ofthe connection lines 201 and 202.

It can be derived from the illustrated arrangement that:

c/d=√{square root over (a ² −b ²)}/b; and

parameter d can then be calculated as follows:

d=bc/√{square root over (a ² −b ²)}.

Given the parameters a and b, the size d of the footprint isproportional to parameter c. The wiring structure 200 can provide areduced footprint of the connection lines compared with the wiringstructure 100 in FIG. 1. This is because the connection lines 201 and202 now do not need to be concentrated in the middle of the bonding areaBA as in FIG. 1, and therefore parameter c can be significantly reduced.Advantageously, in an application scenario such as the TDDI product ofFIG. 1, the wiring structure 200 can enable a smaller bezel, increasingthe space utilization of the touch display panel. In addition, since thefirst connection lines 201 and the second connection lines 202 do notintersect each other, the parasitic capacitance caused by the connectionlines is effectively reduced, thereby improving the sensitivity andaccuracy of the touch operation of the touch display panel.

FIG. 3 shows a schematic view of a display device 300 in which thewiring structure 200 can be applied. By way of example and notlimitation, the display device 300 includes a cell phone, a tablet, atelevision, a notebook, a digital photo frame, a navigator, or the like.

Referring to FIG. 3, the display device 300 includes a touch displaypanel 320, a driver 310, and the wiring structure 200 disposed betweenthe touch display panel 320 and the driver 310. The touch display panel320 may be a self-capacitive touch display panel or a mutual capacitivetouch display panel. Touch signal lines (not shown) and display signallines (not shown) in the touch display panel 320 are connected, via thewiring structure 200, to corresponding ones of the pins (not shown) ofthe driver 310 disposed in the bonding area BA of the driver 310. Inthis embodiment, the driver 310 is a TDDI driver integrated with a touchdriving circuit and a display driving circuit. The driver 310 may beimplemented as a single driver chip or alternatively may includemultiple driver chips.

The display device 300 further includes a substrate 330 on which thedriver 310 is carried. Depending on how the driver 310 is implemented onthe substrate 330, the wiring structure 200 may take different forms. Inembodiments where the substrate 330 is a glass substrate, the wiringstructure 200 is adapted to a chip on glass (COG) solution. Inembodiments where the substrate 330 is a thin film substrate, the wiringstructure 200 is adapted to a chip on film (COF) solution. For the COGsolution, the wiring structure 200 allows the bezel size to be reducedby not less than 0.5 mm compared with the wiring structure 100. For theCOF solution, it may even be possible to make the fan-out area notaffect the bottom bezel, thus facilitating the realization of abezel-less screen.

FIG. 4 schematically shows the connection relationship between theconnection lines and the signal lines in FIG. 3 in an enlarged view.

Referring to FIG. 4, a plurality of display signal lines 301 and aplurality of touch signal lines 302 are connected to respective ones ofthe first connection lines 201 or second connection lines 202, with theconnection points (indicated by squares) serving as the first electricalcontacts 210 in FIG. 2. The first connection lines 201 are disposed inthe same layer as the display signal lines 301 (both indicated by solidlines), and the second connection lines 202 are disposed in the samelayer as the touch signal lines 302 (both indicated by dashed lines).

In the example of FIG. 4, the plurality of first connection lines 201and the plurality of second connection lines 202 are arranged such thatwhen viewed from a direction perpendicular to the first and secondwiring layers (i.e., a direction perpendicular to the paper plane in thefigure) the first connection lines 201 and the second connection lines202 alternate with each other. Further, the alternating first and secondconnection lines 201 and 202 are divided into a plurality of firstgroups 20 a configured to transfer a first type of signals (displaysignals in this example) and a plurality of second groups 20 bconfigured to transfer a second type of signals (touch signals in thisexample), with the first groups 20 a and the second groups 20 balternating with each other. Specifically, the connection lines 201 and202 in the first groups 20 a are connected to respective ones of thedisplay signal lines 301, and the connection lines 201 and 202 in thesecond groups 20 b are connected to respective ones of the touch signallines 302. In this example, the plurality of first groups 20 a eachinclude one first connection line 201 and two second connection lines202, and the plurality of second groups 20 b each include one firstconnection line 201. In other embodiments, the first group 20 a and thesecond group 20 b may include more or fewer first connection lines 201and/or more or fewer second connection lines 202. This provides analternative wiring design that enables adaptation to the specificationsof the touch display panel and the driver.

FIG. 5 schematically shows a variation of the connection relationshipshown in FIG. 4 in an enlarged view. In this embodiment, the firstconnection lines 201 are disposed in the same layer as the touch signallines 302 (both indicated by solid lines), and the second connectionlines 202 are disposed in the same layer as the display signal lines 301(both indicated by dashed lines). This provides an alternative wiringdesign that enables adaptation to the specifications of the touchdisplay panel and the driver.

FIG. 6 schematically shows another variation of the connectionrelationship shown in FIG. 4 in an enlarged view. As previouslydescribed, the alternating first and second connection lines 201 and 202are divided into a plurality of first groups 20 a configured to transfera first type of signals (e.g., display signals) and a plurality ofsecond groups 20 b configured to transfer a second type of signals(e.g., touch signals). In this example, the plurality of first groups 20a each include one first connection line 201 and one second connectionline 202, and the plurality of second groups 20 b each also include onefirst connection line 201 and one second connection line 202. In otherembodiments, the first group 20 a and the second group 20 b may includemore or fewer first connection lines 201 and/or more or fewer secondconnection lines 202. This provides an alternative wiring design thatenables adaptation to the specifications of the touch display panel andthe driver.

FIG. 7 is a cross-sectional view taken along line A-A in FIG. 4, showingthe electrical connections between the signal lines 301, 302 and theconnection lines 201, 202.

As shown in FIG. 7, three display signal lines 301 and two firstconnection lines 201 are disposed in a first wiring layer 231, and onetouch signal line 302 and two second connection lines 202 are disposedin a second wiring layer 232. An insulating layer 203 is disposedbetween the first wiring layer 231 and the second wiring layer 232 toprovide electrical insulation. The electrical connection between thefirst wiring layer 231 and the second wiring layer 232 is provided byvias 205 disposed in the insulating layer 203.

The electrical connections between the signal lines and the connectionlines are described in the direction from left to right in the figure.In the first pair of signal line and connection line, the firstconnection line 201 in the first wiring layer is connected to the touchsignal line 302 in the second wiring layer 232 through the via 205. Inthe second pair of signal line and connection line, the secondconnection line 202 in the second wiring layer 232 is connected to thedisplay signal line 301 in the first wiring layer 231 through the via205. In the third pair of signal line and connection line, the firstconnection line 201 in the first wiring layer 231 is connected to thedisplay signal line 301 in the first wiring layer 231, with no need forthe via. In the fourth pair of signal line and connection line, thesecond connection line 202 in the second wiring layer 232 is connectedto the display signal line 301 in the first wiring layer 231 through thevia 205. In this way, the electrical connection between the touchdisplay panel 320 and the wiring structure 200 (FIG. 3) is achievedwithout the connection lines 201 and 202 intersecting.

Depending on the arrangement of the display signal lines 301 and thetouch signal lines 302 in the touch display panel 320, the arrangementof the pins in the bonding area BA (FIG. 3) of the driver chip 310 canbe adjusted accordingly.

FIG. 8 shows various arrangements of the pins of a TDDI driver 310 foruse in cooperation with a wiring structure in accordance with anexemplary embodiment of the present disclosure. As shown in FIG. 8, thebonding area BA of the driver chip 310 includes a plurality of firstpins 311 for supplying display signals and a plurality of second pins312 for supplying touch signals. In the example (a), the first pins 311and the second pins 312 are alternately arranged. In the example (b), asecond pin 312 is provided every two directly adjacent first pins 311.In the example (c), a second pin 312 is provided every three directlyadjacent first pins 311. In the example (d), the plurality of secondpins 312 are interspersed among the plurality of first pins 311.

FIG. 9 shows an example connection relationship between the wiringstructure 200 and the TDDI driver 310. As shown in FIG. 9, the firstpins 311 are connected to the first groups of connection lines 20 a forthe display signal lines, and the second pins 312 are connected to thesecond connection lines 20 b for touch signal lines. It will beunderstood that the connection relationship shown in FIG. 9 is exemplaryand that other embodiments are possible.

FIG. 10 is a flow chart showing a method 1000 of manufacturing a wiringstructure in accordance with an exemplary embodiment of the presentdisclosure. As described above, the wiring structure is for connecting aplurality of first electrical contacts to respective ones of a pluralityof second electrical contacts, the plurality of first electricalcontacts are arranged along a straight line over a first span, theplurality of second electrical contacts are arranged along a straightline over a second span, and the second span is less than the firstspan.

At step 1001, a plurality of first connection lines are formed in thefirst wiring layer that extend respectively from first ones of theplurality of first electrical contacts to first ones of the plurality ofsecond electrical contacts, with the first connection lines notintersecting each other. At step 1002, a plurality of second connectionlines are formed in the second wiring layer that extend respectivelyfrom second ones of the plurality of first electrical contacts to secondones of the plurality of second electrical contacts, with the secondconnection lines not intersecting each other. An orthographic projectionof any one of the first connection lines onto a plane parallel to thefirst and second wiring layers does not intersect an orthographicprojection of any one of the second connection lines onto the plane.

The details of the wiring structure embodiments described above withrespect to FIGS. 2 to 9 apply to the method 1000, and the method 1000can provide the same advantages accordingly, which will not be repeatedherein.

Although the various steps of the method of the present disclosure aredescribed in a particular order in the figures, this is not to beconstrued as requiring or implying that the steps should be performed inthe specific order, or that all the steps shown should be performed toachieve the desired result. Additionally or alternatively, certain stepsmay be omitted, multiple steps may be combined into one step forexecution, and/or one step may be decomposed into multiple steps forexecution, and the like.

Other embodiments of the present disclosure will be apparent to thoseskilled in the art after considering the specification and practicingthe present disclosure. The present application is intended to cover anyvariations, uses, or adaptations of the present disclosure, whichvariations, uses, or adaptations are in accordance with the generalprinciples of the disclosure and include common knowledge or commontechnical means in the art that are not disclosed in the presentdisclosure. The described embodiments and the illustrated figures are tobe considered as exemplary only, and the scope of the disclosure isdefined by the claims.

1. A wiring structure for connecting a plurality of first electricalcontacts to respective ones of a plurality of second electricalcontacts, the plurality of first electrical contacts being arranged in astraight line over a first span, the plurality of second electricalcontacts being arranged in a straight line over a second span, thesecond span being less than the first span, the wiring structurecomprising: a plurality of first connection lines in a first wiringlayer, wherein the plurality of first connection lines extendrespectively from first ones of the plurality of first electricalcontacts to first ones of the plurality of second electrical contactsand do not intersect each other; and a plurality of second connectionlines in a second wiring layer, wherein the plurality of secondconnection lines extend respectively from second ones of the pluralityof first electrical contacts to second ones of the plurality of secondelectrical contacts and do not intersect each other, wherein anorthographic projection of any one of the first connection lines onto aplane parallel to the first and second wiring layers does not intersectan orthographic projection of any one of the second connection linesonto the plane.
 2. The wiring structure of claim 1, wherein theplurality of first connection lines and the plurality of secondconnection lines are arranged such that the first connection lines andthe second connection lines alternate with each other when viewed from adirection perpendicular to the first and second wiring layers.
 3. Thewiring structure of claim 2, wherein the first and second connectionlines that alternate with each other are divided into a plurality offirst groups configured to transfer a first type of signals and aplurality of second groups configured to transfer a second type ofsignals, and the first groups and the second groups alternate with eachother.
 4. The wiring structure of claim 3, wherein the plurality offirst groups each comprise at least one of the first connection linesand at least one of the second connection lines, and wherein theplurality of second groups each comprise at least one of the firstconnection lines and at least one of the second connection lines.
 5. Thewiring structure of claim 3, wherein the plurality of first groups eachcomprise at least one of the first connection lines and at least one ofthe second connection lines, and wherein the plurality of second groupseach comprise a respective one of the first connection lines.
 6. Thewiring structure of claim 1, wherein the first connection lines aredifferent in quantity from the second connection lines.
 7. The wiringstructure of claim 1, wherein the first connection lines and the secondconnection lines comprise metal lines.
 8. The wiring structure of claim1, further comprising an insulating layer between the first wiring layerand the second wiring layer.
 9. A method of manufacturing a wiringstructure for connecting a plurality of first electrical contacts torespective ones of a plurality of second electrical contacts, theplurality of first electrical contacts being arranged in a straight lineover a first span, the plurality of second electrical contacts beingarranged in a straight line over a second span, the second span beingless than the first span, the method comprising: forming in a firstwiring layer a plurality of first connection lines that extendrespectively from first ones of the plurality of first electricalcontacts to first ones of the plurality of second electrical contacts,wherein the first connection lines do not intersect each other; andforming in a second wiring layer a plurality of second connection linesthat extend respectively from second ones of the plurality of firstelectrical contacts to second ones of the plurality of second electricalcontacts, wherein the second connection lines do not intersect eachother, wherein an orthographic projection of any one of the firstconnection lines onto a plane parallel to the first and second wiringlayers does not intersect an orthographic projection of any one of thesecond connection lines onto the plane.
 10. A display device comprising:a wiring structure for connecting a plurality of first electricalcontacts to respective ones of a plurality of second electricalcontacts, wherein the plurality of first electrical contacts arearranged in a straight line over a first span, the plurality of secondelectrical contacts are arranged in a straight line over a second span,the second span is less than the first span, and the wiring structurecomprises: a plurality of first connection lines in a first wiringlayer, wherein the plurality of first connection lines extendrespectively from first ones of the plurality of first electricalcontacts to first ones of the plurality of second electrical contactsand do not intersect each other; and a plurality of second connectionlines in a second wiring layer, wherein the plurality of secondconnection lines extend respectively from second ones of the pluralityof first electrical contacts to second ones of the plurality of secondelectrical contacts and do not intersect each other, wherein anorthographic projection of any one of the first connection lines onto aplane parallel to the first and second wiring layers does not intersectan orthographic projection of any one of the second connection linesonto the plane.
 11. The display device of claim 10, further comprising:a touch display panel comprising touch signal lines and display signallines; and a driver integrated with a touch driving circuit and adisplay driving circuit, wherein the driver comprises a bonding area anda plurality of first pins and a plurality of second pins in the bondingarea, the first pins are configured to supply display signals, thesecond pins are configured to supply touch signals, and the first pinsand the second pins are arranged in a straight line in the bonding area,wherein the display signal lines are connected to the first pins via thewiring structure, and wherein the touch signal lines are connected tothe second pins via the wiring structure.
 12. The display device ofclaim 11, further comprising a glass substrate carrying the driver. 13.The display device of claim 11, further comprising a thin film substratecarrying the driver.
 14. The display device of claim 11, wherein thetouch display panel comprises a self-capacitive touch display panel. 15.The display device of claim 11, wherein the touch display panelcomprises a mutual capacitive touch display panel.
 16. The wiringstructure of claim 3, wherein the plurality of first groups eachcomprise at least one of the first connection lines and at least one ofthe second connection lines, and wherein the plurality of second groupseach comprise a respective one of the second connection lines.
 17. Thedisplay device of claim 10, wherein the plurality of first connectionlines and the plurality of second connection lines are arranged suchthat the first connection lines and the second connection linesalternate with each other when viewed from a direction perpendicular tothe first and second wiring layers.
 18. The display device of claim 17,wherein the first and second connection lines that alternate with eachother are divided into a plurality of first groups configured totransfer a first type of signals and a plurality of second groupsconfigured to transfer a second type of signals, and the first groupsand the second groups alternate with each other.
 19. The display deviceof claim 18, wherein the plurality of first groups each comprise atleast one of the first connection lines and at least one of the secondconnection lines, and wherein the plurality of second groups eachcomprise at least one of the first connection lines and at least one ofthe second connection lines.
 20. The display device of claim 10, furthercomprising an insulating layer between the first wiring layer and thesecond wiring layer.